Qualcomm Off Campus Drive 2025 Hiring Interim Engineering Intern

By
Cyber Tecz
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Qualcomm Off Campus Drive 2025
Qualcomm Off Campus Drive 2025

Qualcomm Off Campus Drive 2025 Hiring Interim Engineering Intern

Qualcomm has officially announced its Off Campus Drive 2025, inviting talented engineering graduates to apply for the role of Interim Engineering Intern. This opportunity is ideal for students who are passionate about cutting-edge technologies such as wireless communication, embedded systems, VLSI, and software development. As an intern at Qualcomm, candidates will work alongside industry experts, gain hands-on experience with real-world projects, and build a strong foundation for a successful engineering career. If you are looking to start your professional journey with a global leader in semiconductor innovation, this is the perfect opportunity to apply and kick-start your career.

Job Details

  • Designation: Interim Engineering Intern
  • Company: Qualcomm
  • Educational Qualification: B.E, B.Tech
  • Experience Required: 0 – 1 Year
  • Location:  Bangalore, Hyderabad India 
  • Compensation: Best in Industry

General Summary:

We know our employees’ ideas change the world. For more than three decades, we’ve been a global leader in mobile technology, continually pushing the boundaries of what’s possible. Working with customers across industries — from automotive to health care, from smart cities to robotics— we continue to accelerate innovation and unlock new possibilities in a time where everything is connected. By joining the Qualcomm family, you too can bring the future forward faster.

SOC & Hard Macro Physical Design
• SOC Validation & Debug
• RF & Analog Layout
• RF/Analog/Mixed Signal/Power IC Design
• Low Power Design
• Board and FPGA Design
• Digital ASIC Design
• Design/SOC Verification
• CAD Solution Engineer
• Design for Test (DFT)
• CPU Design

Educational Background:

  • Masters, Bachelors: Electrical Engineering , VLSI , Embedded and VLSI , ECE

Must have educational background in one or more of the following areas:

  • Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs.
  • Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
  • Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus.
  • Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design.
  • Excellent analytical and problem solving skills.
  • Ability to collaborate and work in teams.
  • Good verbal and written communication skill

Interested students can apply directly at 👉 Qualcomm Off Campus Drive 2025

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