Ansys Campus Hiring 2022 Freshers as Application Engineer of Any Degree Graduate
Ansys Campus Hiring 2022: Founded in 1970, ANSYS employs more than 2,900 professionals, and many of them are engineers expert in fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Our staff includes more master’s and Ph.D.-level engineers than any other simulation provider. ANSYS is passionate about pushing the limits of world-class technology, all so our customers can turn their design concepts into successful, innovative products.
Company Name: ANSYS
Wikipedia: ANSYS Wiki
Job Profile: Application Engineer
Passout Batch: 2020/2021/2022
Work Location: Bangalore
Package: Best In Industry
Experience Level: 0 – 2 Years
Jobs By Location And Passout Year:
|2015 Batch||2018 Batch||2021 Batch|
|2016 Batch||2019 Batch||2022 Batch|
|2017 Batch||2020 Batch||2023 Batch|
Minimum Education/Certification Requirements and Experience:
- Bachelor’s/Master’s degree in Electronics Engineering/VLSI from Top Institutions (NITs/IITs and likes)
- Strong problem-solving skills
- Good programming skills
- Excellent verbal and written communication skills
Preferred Qualifications and Skills:
- Passion to learn and deploy new technologies.
- Ability for minimal travel
- 0-2 years of prior experience in either of a) ASIC Physical design, b) Power-Integrity/Signal-Integrity/Reliability Closure c) Custom circuit design and simulation
Key Duties and Responsibilities:
Be part of Application Engineering Team that
- Works with Global-Customers / IP-providers / Foundries to understand design challenges of cutting-edge SoCs & 3DICs on 7/5/3 nm and creates EDA product specifications.
- Works with Product development team to get state-of-the-art EDA products developed.
- Works on Ansys-Seascape platform – Semiconductor Industry’s First and Only True Big-Data design Platform!
- Works with top Semiconductor companies around the globe to deploy EDA products for solving Power/Signal/Reliability challenges across Chip-Package-System at 7/5/3 nm.
- Provides expert guidance/consultation to Customers around the globe for solving design challenges.
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